Hermetic packaging market players are looking to consolidate their position by offering high-quality, yet cost-effective solutions to end-users, according to a new study by Future Market Insights. The market study tracks global hermetic packaging sales globally for the period 2020-2030. Hermetic Packaging Market categorizes the Global market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), and Region. COVID-19 Impact on Hermetic Packaging Industry.
Hermetic packaging has acquired immense importance across the packaging industry. Over the years, hermetic packaging has been adopted across several important industries, most notably in the electronics sector. The ability to offer enhanced protection from hostile environmental conditions makes them a highly preferred approach by leading electronics manufacturers.
Some applications of hermetic sealing include thermostats, semiconductor electronics, MEMS, switches and optical devices. These electronic parts may be hermetically sealed to prevent damage from water vapor or other forms of moisture and other highly volatile elements. Additionally, surveillance equipment for defense and military also make exhaustive usage of hermetic seals.
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- Transponder glass hermetic packaging to capture the lion’s share of the market
- Rising national security concerns to accelerate defense & military equipment demand, leading to proliferation of defense hermetic packaging
- Ceramic to metal sealing to emerge as the fastest expanding hermetic packaging solution
- China to emerge as a hotbed for hermetic packaging, attributed to rising demand for consumer electronics
“Deepening penetration of smart technologies is expected to heighten demand for smart devices, prompting vendors to enhance research capacities to launch robust hermetic packaging solutions,” infers the FMI analyst
The COVID-19 pandemic has resulted in adverse financial impediments across several industry verticals. With economies of countries witnessing a slump in their GDPs and trade volumes, revenue margins are declining rapidly, inducing major sluggishness.
The hermetic packaging market is among the industries which are affected by the pandemic. However, this slowdown is expected to be moderate as demand for electronic goods such as smartphones and laptops is increasing in the wake of issuance of work from home guidelines.
Also, demand in the defense sector is likely to sustain demand for hermetic packaging, as national security concerns have acquired an even greater priority due to concerns of foreign aggression amongst the world’s major military powers such as the United States, China and India.
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The global hermetic packaging market comprises of several prominent players who are vying to acquire a significant competitive edge by deploying multiple expansion strategies, including research capacity expansion, foraying into untapped markets, product launches and collaborations.
Some leading players in this landscape are AMETEK Inc., Amkor Technology Inc., Egide SA, Kyocera Corporation, Legacy Technologies Inc., Materion Corporation, Micross Components, SCHOTT AG, Teledyne Microelectric Technologies and Texas Instruments Inc.
AMETEK Inc. is a leading player in the hermetic packaging market. In 2017, the company expanded its electronic components and packaging business division by incorporating its Aegis, Glasseal, SCP, Hermetic Seal, Coining and Sealtron brands under a single umbrella.
With respect to solution offerings, Kyocera Corporation provides glass hermetic feedthroughs and connectors in the form of D-subminiature connectors and RF coaxial feedthroughs. These fittings are used for a variety of applications, ranging from scientific and technological equipment to semiconductor manufacturing equipment.
Future Market Insights, in its new report, offers an unbiased analysis of the global hermetic packaging market, analyzing historical demand from 2015-2019 and forecast statistics for 2020-2030. The study reveals growth projections on the hermetic packaging market on the basis of hermetic seal type (epoxy hermetic seals, glass to metal (GTM) hermetic seals, ceramic to metal (CTM) hermetic seals & glassware sealing), configuration (multilayer ceramic packages, metal can packages and pressed ceramic packages), application (semiconductor electronics, thermostats, optical devices, switches, microelectromechanical systems (MEMS), electrical or electronic parts & batteries) and end-use (electronics & electrical manufacturing, automotive & mechanical parts, aerospace, telecommunications, military & defense and others (pharmaceuticals and building & construction) across seven prominent regions.
The Packaging division at FMI provides an in-depth historical analysis and granular projections of the global packaging market. Ranging from packaging materials to designs & formats, FMI has an exhaustive market research database, serving clients with unique offerings and strategic recommendations. With a repository of 750+ reports, the team analyzed the packaging industry comprehensively in 70+ countries. The team evaluates every node of the value chain and provides end-to-end research and consulting services; reach out to explore how we can help
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